By the Porta del Popolo or by the streets, your excellencies?

It is also possible to delete a key: value pair with del.

也可以用del来删除关键字: 值对.

E'il figlio del mio Terzo fratello ,-rispose lo zio.

许三观的叔叔说:是我三哥的儿子.

Nedved does not think that Del Piero will leave Juventus.

内德维德不认为皮耶罗会离开.

Giorgio Del Vecchio distinguish sharply between the concept of law and the ideal of law.

乔治奥·德尔·韦基奥严格地将法律概念和法律理想作了区别.

Can I give Del and Mr. Jingles some?

我可以分一点给戴尔和金格先生 吗 ?

Adem á s, el equipo juega r á pido , lo que favorecer í a las caracter í sticas del espa? ol .

除此之外, 球队快打旋风的 打球 风格是西班牙人的最爱.

Tu e Del Piero avete anche un'altra cosa in comune.

你和德尔皮耶罗还有也有一点相同的地方.

Chelsea has injury worries over Arjen Robben and Asier del Horno.

罗本和德尔诺的受伤令切尔西人焦心.

Los estudiantes, cuyas madres lloraban en el pasillo, fueron expulsados del colegio.

学生们的母亲们在走廊哭着, 由学校被驱逐了.

Your system is now locked. To restart your system, press Ctrl + alt + del.

你的系统现在锁定了, 按Ctrl+alt+del重新启动你的系统.

However, Lamikiz admitted he would not stand in Del Horno's way.

然而, 拉米基兹承认他不会对德尔奥诺转会一事横加阻挠.

Multiplex PCR was used to determine whether the DEL has the intact RHD gene.

DEL的 基因组DNA, 首先通过多重PCR(multiplexpolymerasechainreaction,MPX—PCR),研究其RHD基因是否存在片断缺失.

In this paper, by using Heath-H ( ? ) del-mappings we give a characterizationof C-Semi-stratifiable spacs, C-Nagata spaces, KC-semi-stratifiable spacesand K-semi-stratifiable spaces.

本文用Heath -H? del 映象给出C - 半 分层空间, C-Nagata空间, KC - 半分层空间和K - 半分层空间的一种刻划.

And acrylate is of better functions for aluminum powder to delaminate and felt at room temperature.

指出改性丙烯酸酯对于铝粉室温分层粘结有着较好的前景.

Most wave energy propagates only in the composite plates up and below the delamination.

并且波的能量大部分在脱层处的上、下复合材料板中来回传播,被反射和透射出的能量很少.

The main wear mechanisms of the coating are abrasive wear and delamination wear.

涂层的磨损机制主要是磨粒磨损和剥层磨损.

Interfacial tractions at the broken ends will produce delamination.

断头处的界面引力将引起分层.

These inner and outer factors cause interface delamination, which is more serious in the density package.

这些内部和外部的因素直接导致了高密度芯片封装中粘结膜界面分层现象日趋严重.

Minimum adhesive strength build up ensures easy peeling without adhesive migration and delamination.

低逐加粘合度可确保易于剥离而不会产生溢胶和分离.

By the global-local method, the delamination study was implemented from mm scale to um scale.

通过“全局 - 局部”模拟方法, 将各向异性导电膜的界面分层研究从毫米级深入到亚微米级.